Brand: Oxford Instruments

Model: Plasmalab System 100

The Oxford Instruments Inductively Coupled Plasma Reactive Ion Etch system is typically used for etching Si₃N₄, SiO₂ and Si. The tool is load-locked and is configured to handle 4-inch wafers.

The Oxford system has an optical emission endpoint detector. It can be operated at temperatures from -20°C up to 50°C.